Chip-Cooling Breakthrough Will Reduce Data-Center Power Costs
Networkworld, November 20th, 2018
December 2, 2018,
Volume 248, Issue 4

"A new microprocessor manufacturing technique could keep future electronics 18 degrees cooler, providing huge efficiency gains for data centers," reports Patrick Nelson in Networkworld.

"Traditional passive heatsinks affixed to microprocessors for cooling don't work well enough for today's high-speed computations and data throughputs and should be junked, says a group of mechanical engineering researchers..."

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